Thermal Interface Materials made by YU
[Thermally Conductive Gap-fillers]
Gap Fillers | Resins | T. Conductivity | Curing | Density | Viscosity | Remarks |
YUGF-S65-ER | Silicone | 6.5 W/m-K | 24h @ 23oC | 3.15g/cm3 | 210/230 Pa.S @ 1/S | D1LS-GLSRT800V* 5/03-5/09 |
YUGF-S50-ER | Silicone | 5.0 W/m-K | 4h @ 23oC | 3.0 g/cm3 | @ 1/S | D1LSRT(LT)SH764TV_1 5/28 |
LDGF-S23-ER | Silicone | 2.3 W/m-K | 4h @ 23oC | 2.1 g/cm3 | 120/120 Pa.S @ 1/S | D1LSMHGRTSH807TV 6/20 |
LDGF-S20-ER | Silicone | 2.0 W/m-K | 4h @ 23oC | 1.9 g/cm3 | 140/140 Pa.S @ 1/S | D1LSPHGRTSH801TV 6/22 |
LDGF-S30-ER | " | 3.0 W/m-K | " | 1.99 | 61 Shore 00 | D1AAARTSH740TV 10/24 |
LDGF-S31-ER | " | 3.1 W/m-K | " | 2.0 | 65 Shore 00 | D1ALTSH740TV 09/05 |
[Urethane Thermally Conductive Adhesives]
Adhesives | Resins | T. Conductivity | Density | Lap-shear Strength to Al | Remarks |
UAHK-43-YU | Polyurethane | 4.3 W/m-K | 2.85 g/cm3 | 0.70 / 2.55 MPa | 2 components |
UALD-K25-YU | Polyurethane | 2.5 W/m-K | 1.97 g/cm3 | 1.45 / 2.35 MPa | " |
UALD-K31-YU | Polyurethane | 3.1 W/m-K | 2.40 g/cm3 | 1.19 / 2.28 MPa | " |
UAMK-K33-YU | Polyurethane | 3.4 W/m-K | 2.75 g/cm3 | 1.55 / 1.90 MPa | " |
[Thermally Conductive Greases]
Greases | Resins | T. Conductivity | Density | Viscosity | Remarks |
YUGR-S65-ER | Silicone | 6.5 W/m-K | 3.15g/cm3 | 190 Pa.S @ 1/S | D1LSRT800V*-B 5/03 |
YUGR-S70-ER | Silicone | 7.0 W/m-K | 3.2 g/cm3 | 190 Pa.S @ 1/S | D1LSRT820V-A 4/28 |